Intrinsix to present at IEEE IMS 2019 “Simulation and Verification of RF and mmWave Devices at the System, Package, and Device Level”
Boston, MA June 4, 2019
Intrinsix will be presenting “Simulation and Verification of RF and mmWave Devices at the System, Package, and Device Level” at this year’s IEEE International Microwave Symposium (IMS) in Boston, MA. The presentation will be given by Finbarr McGrath, Solutions Architect for RFICs, and Brian Jones, Technical Manager for Mixed-Signal/RF ASIC Design on Tuesday, June 4th at 3:30pm in the Cadence Booth/Demo Theater (Booth 942) at the IEEE International Microwave Symposium held at the Boston Convention & Exhibition Center, Boston, MA.
Schedule for this and other Cadence Demo Theater Presentations can be found here.
For more information about IEEE IMS Boston 2019, please visit the Conference web site.
About Intrinsix Corp.
Intrinsix Corp., headquartered in Marlborough, MA USA, is a design services company for advanced semiconductors with clients around the globe. The company has been servicing the needs of electronic product and semiconductor companies for more than 30 years. Intrinsix has the platforms, process and people to ensure first-turn success for industry-leading semiconductors. For more information, please visit: www.intrinsix.com/.